현도빈 2024-01-21T17:44:26Z 2024-01-21T17:44:26Z 2022-01-10 1997-12 https://pubs.kist.re.kr/handle/201004/143478 Development of thermoelectric cooling module IC package용 cooling module 개발 Article 3 대한금속학회회보 = Bulletin of the Korean Inst. of Met. & Mat., v.10, no.6, pp.667 - 675 대한금속학회회보 = Bulletin of the Korean Inst. of Met. & Mat. 10 6 667 675 Thermoelectrics Thermoelectric cooling module