김용태 김동준 이창우 박종완 2024-01-21T18:02:40Z 2024-01-21T18:02:40Z 2022-01-10 1997-10 https://pubs.kist.re.kr/handle/201004/143561 Thermal stabilities of PECVD W-B-N thin films as a diffusion barrier. Article 3 Multilevel interconnect technology (SPIE)., v.v. 3214, pp.48 - 56 Multilevel interconnect technology (SPIE). v. 3214 48 56 thermal stability