Sadler, DJ Zhang, WJ Ahn, CH Kim, HJ Han, SH 2024-01-21T18:06:20Z 2024-01-21T18:06:20Z 2021-09-05 1997-09 0018-9464 https://pubs.kist.re.kr/handle/201004/143622 Semi-encapsulated spiral inductors for microelectromechanical systems (MEMS) applications have been designed, fabricated, and characterized using micromachining and electroplating techniques. The inductors are fabricated on a Pyrex glass wafer using a simple three mask process and have an area of 4 mm by 4 mm. Devices consist of electroplated copper conductor lines with width 50 mu m, thickness 25 mu m, and spacing 30 mu m; they are semi-encapsulated with an electroplated Ni-Fe (81%/19%) magnetic core. At the low frequency of 10kHz, the inductance of the devices was measured as 1.5 mu H, while they exhibited a low resistance of only 3 ohms. Their low resistance and reasonably high inductance makes them ideal in MEMS applications as either sensors or actuators. English IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC Micromachined semi-encapsulated spiral inductors for microelectromechanical systems (MEMS) applications Article 10.1109/20.617930 1 IEEE TRANSACTIONS ON MAGNETICS, v.33, no.5, pp.3319 - 3321 IEEE TRANSACTIONS ON MAGNETICS 33 5 3319 3321 scie scopus A1997XW56400231 Engineering, Electrical & Electronic Physics, Applied Engineering Physics Article; Proceedings Paper MEMS spiral inductors