Park, CM Min, KI Shin, KH 2024-01-21T19:15:43Z 2024-01-21T19:15:43Z 2021-09-05 1996-09 0018-9464 https://pubs.kist.re.kr/handle/201004/144339 The low-field magnetoresistance behavior was investigated for sputter-deposited NiFe 80 Angstrom/Cu 28 Angstrom/NiFe 40 Angstrom/FeMn 150 Angstrom spin valve multilayers under various process conditions (buffer layers, argon sputtering pressure, and Cu-sputtering power). Topological dependence of MR characteristics was observed by atomic force microscope (AFM) surface analyses. We discuss the effects of the process parameters on the bias field and the field sensitivity in terms of topological coupling associated with the interface roughness. In addition, we could control the MR characteristics utilizing it combination of the process parameters which significantly affect the surface and interface roughness of multilayers. English IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC Effects of surface-roughness related process parameters on the magnetoresistive characteristics of spin valves Article 10.1109/20.538644 1 IEEE TRANSACTIONS ON MAGNETICS, v.32, no.5, pp.3422 - 3424 IEEE TRANSACTIONS ON MAGNETICS 32 5 3422 3424 scie scopus A1996VM25800020 2-s2.0-0030244910 Engineering, Electrical & Electronic Physics, Applied Engineering Physics Article; Proceedings Paper spin valve