JU, BK OH, MH TCHAH, KH 2024-01-21T21:40:28Z 2024-01-21T21:40:28Z 2021-09-02 1994-02-01 0022-2461 https://pubs.kist.re.kr/handle/201004/145628 A new type of silicon membrane structure was fabricated using wafer fusion bon ng an two-step electrochemical etch-stopping methods. An ''active wafer'' of p-type epi/n-type epi/p-type substrate was first eletrochemically etched to form a shallow cavity on the p-type epitaxial layer. Then, the cavity-formed side was fusionally bonded with p-type silicon ''working wafer'' and, afterwards, the p-type substrate of the active wafer part was removed by a second electrochemical etch-stopping leaving only the n-type membrane on the shallow cavity. Using the new membrane structure in mechanical sensors, more precise control of cavity depth and membrane thickness was achievable and the influence of crystalline imperfections on the sensing circuits located near the bonding seam was avoidable. English SPRINGER ETHYLENEDIAMINE-PYROCATECHOL-WATER PRESSURE SENSORS THICKNESS CONTROL PASSIVATION FABRICATION OF SILICON MEMBRANE USING FUSION BONDING AND 2-STEP ELECTROCHEMICAL ETCH-STOPPING Article 10.1007/BF00445976 1 JOURNAL OF MATERIALS SCIENCE, v.29, no.3, pp.664 - 668 JOURNAL OF MATERIALS SCIENCE 29 3 664 668 scie scopus A1994MW33300009 2-s2.0-0028378557 Materials Science, Multidisciplinary Materials Science Article ETHYLENEDIAMINE-PYROCATECHOL-WATER PRESSURE SENSORS THICKNESS CONTROL PASSIVATION micromachining direct bonding micromechanical structure