ARNOLD, FE CHENG, SZD HSU, SLC LEE, CJ HARRIS, FW LAU, SF 2024-01-21T23:12:27Z 2024-01-21T23:12:27Z 2022-01-11 1992-01 0032-3861 https://pubs.kist.re.kr/handle/201004/146485 The essential properties of polyimide films of importance in microelectronic applications are thermal and thermo-oxidative stability, dimensional stability, glass transition behaviour and the relative permittivity (dielectric constant epsilon'). A segmented rigid-rod polyimide was synthesized from 3,3',4,4'-biphenyltetracarboxylic dianhydride (BPDA) and 2,2'-bis(trifluoromethyl)-4,4'-diaminobiphenyl (PFMB) in order to develop new materials for microelectronic applications. The thermal and thermo-oxidative stability were investigated by determining the thermal degradation activation energy in air (210 kJ mol-1) and in nitrogen (303 kJ mol-1). The thermal stability was further studied through thermogravimetry-mass spectroscopy. The coefficient of thermal expansion, which indicates the dimensional stability, was measured via a tension mode of a thermomechanical analyser and doubly extrapolated to zero stresses, and was 6.98 x 10(-6)-degrees-C-1 for the BPDA-PFMB films. The glass transition temperature, measured thermomechanically, was found to be 287-degrees-C. The dielectric constant for the films, measured after ageing at 50% relative humidity for 48 h at 23-degrees-C, was between 2.8 and 2.9 in a frequency range from 0.1 kHz to 1 MHz. The temperature and frequency dependence of the dielectric behaviour is also discussed. English ELSEVIER SCI LTD THERMAL-EXPANSION COEFFICIENT X-RAY-SCATTERING AROMATIC POLYIMIDES 4-HYDROXYBENZOIC ACID POLYMER GLASSES FREE-VOLUME RELAXATION BEHAVIOR HISTORY ORGANOSOLUBLE, SEGMENTED RIGID-ROD POLYIMIDE FILMS .2. PROPERTIES FOR MICROELECTRONIC APPLICATIONS Article 10.1016/0032-3861(92)90798-2 1 POLYMER, v.33, no.24, pp.5179 - 5185 POLYMER 33 24 5179 5185 scie scopus A1992KE17100008 Polymer Science Polymer Science Article THERMAL-EXPANSION COEFFICIENT X-RAY-SCATTERING AROMATIC POLYIMIDES 4-HYDROXYBENZOIC ACID POLYMER GLASSES FREE-VOLUME RELAXATION BEHAVIOR HISTORY COEFFICIENT OF THERMAL EXPANSION DIMENSIONAL STABILITY GLASS TRANSITION TEMPERATURE MICROELECTRONIC APPLICATION RELATIVE PERMITTIVITY SEGMENTED RIGID-ROD POLYIMIDE FILM THERMAL AND THERMOOXIDATIVE STABILITY THERMOGRAVIMETRIC MASS SPECTROSCOPY THERMOMECHANICAL MEASUREMENT