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<dublin_core schema="dc">
<dcvalue element="contributor" qualifier="author">Su-Yeon&#x20;Joung</dcvalue>
<dcvalue element="contributor" qualifier="author">Haena&#x20;Yim</dcvalue>
<dcvalue element="contributor" qualifier="author">Donghun&#x20;Lee</dcvalue>
<dcvalue element="contributor" qualifier="author">Jaehyung&#x20;Shim</dcvalue>
<dcvalue element="contributor" qualifier="author">So&#x20;Yeon&#x20;Yoo</dcvalue>
<dcvalue element="contributor" qualifier="author">Yeon&#x20;Ho&#x20;Kim</dcvalue>
<dcvalue element="contributor" qualifier="author">Jin&#x20;Seok&#x20;Kim</dcvalue>
<dcvalue element="contributor" qualifier="author">Hyunjun&#x20;Kim</dcvalue>
<dcvalue element="contributor" qualifier="author">Seok-Ki&#x20;Hyeong</dcvalue>
<dcvalue element="contributor" qualifier="author">Junhee&#x20;Kim</dcvalue>
<dcvalue element="contributor" qualifier="author">Yong-Young&#x20;Noh</dcvalue>
<dcvalue element="contributor" qualifier="author">Sukang&#x20;Bae</dcvalue>
<dcvalue element="contributor" qualifier="author">Myung&#x20;Jin&#x20;Park</dcvalue>
<dcvalue element="contributor" qualifier="author">Ji-Won&#x20;Choi</dcvalue>
<dcvalue element="contributor" qualifier="author">Chul-Ho&#x20;Lee</dcvalue>
<dcvalue element="date" qualifier="accessioned">2024-01-25T06:00:49Z</dcvalue>
<dcvalue element="date" qualifier="available">2024-01-25T06:00:49Z</dcvalue>
<dcvalue element="date" qualifier="created">2024-01-25</dcvalue>
<dcvalue element="date" qualifier="issued">2024-01</dcvalue>
<dcvalue element="identifier" qualifier="issn">1936-0851</dcvalue>
<dcvalue element="identifier" qualifier="uri">https:&#x2F;&#x2F;pubs.kist.re.kr&#x2F;handle&#x2F;201004&#x2F;148472</dcvalue>
<dcvalue element="description" qualifier="abstract">Assembling&#x20;solution-processed&#x20;van&#x20;der&#x20;Waals&#x20;(vdW)&#x20;materials&#x20;into&#x20;thin&#x20;films&#x20;holds&#x20;great&#x20;promise&#x20;for&#x20;constructing&#x20;large-scale,&#x20;high-performance&#x20;thin-film&#x20;electronics,&#x20;especially&#x20;at&#x20;low&#x20;temperatures.&#x20;While&#x20;transition&#x20;metal&#x20;dichalcogenide&#x20;thin&#x20;films&#x20;assembled&#x20;in&#x20;solution&#x20;have&#x20;shown&#x20;potential&#x20;as&#x20;channel&#x20;materials,&#x20;fully&#x20;solution-processed&#x20;vdW&#x20;electronics&#x20;have&#x20;not&#x20;been&#x20;achieved&#x20;due&#x20;to&#x20;the&#x20;absence&#x20;of&#x20;suitable&#x20;dielectric&#x20;materials&#x20;and&#x20;high-temperature&#x20;processing.&#x20;In&#x20;this&#x20;work,&#x20;we&#x20;report&#x20;on&#x20;all-solution-processedvdW&#x20;thin-film&#x20;transistors&#x20;(TFTs)&#x20;comprising&#x20;molybdenum&#x20;disulfides&#x20;(MoS2)&#x20;as&#x20;the&#x20;channel&#x20;and&#x20;Dion？Jacobson-phase&#x20;perovskite&#x20;oxides&#x20;as&#x20;the&#x20;high-permittivity&#x20;dielectric.&#x20;The&#x20;constituent&#x20;layers&#x20;are&#x20;prepared&#x20;as&#x20;colloidal&#x20;solutions&#x20;through&#x20;electrochemical&#x20;exfoliation&#x20;of&#x20;bulk&#x20;crystals,&#x20;followed&#x20;by&#x20;sequential&#x20;assembly&#x20;into&#x20;a&#x20;semiconductor&#x2F;dielectric&#x20;heterostructure&#x20;for&#x20;TFT&#x20;construction.&#x20;Notably,&#x20;all&#x20;fabrication&#x20;processes&#x20;are&#x20;carried&#x20;out&#x20;at&#x20;temperatures&#x20;below&#x20;250&#x20;°C.&#x20;The&#x20;fabricated&#x20;MoS2&#x20;TFTs&#x20;exhibit&#x20;excellent&#x20;device&#x20;characteristics,&#x20;including&#x20;high&#x20;mobility&#x20;(&gt;10&#x20;cm2&#x20;V-1&#x20;s-1)&#x20;and&#x20;an&#x20;on&#x2F;off&#x20;ratio&#x20;exceeding&#x20;106.&#x20;Additionally,&#x20;the&#x20;use&#x20;of&#x20;a&#x20;high-k&#x20;dielectric&#x20;allows&#x20;for&#x20;operation&#x20;at&#x20;low&#x20;voltage&#x20;(∼5&#x20;V)&#x20;and&#x20;leakage&#x20;current&#x20;(∼10？11&#x20;A),&#x20;enabling&#x20;low&#x20;power&#x20;consumption.&#x20;Our&#x20;demonstration&#x20;of&#x20;the&#x20;low-temperature&#x20;fabrication&#x20;of&#x20;high-performance&#x20;TFTs&#x20;presents&#x20;a&#x20;cost-effective&#x20;and&#x20;scalable&#x20;approach&#x20;for&#x20;heterointegrated&#x20;thin-film&#x20;electronics.</dcvalue>
<dcvalue element="language" qualifier="none">English</dcvalue>
<dcvalue element="publisher" qualifier="none">American&#x20;Chemical&#x20;Society</dcvalue>
<dcvalue element="title" qualifier="none">All-Solution-Processed&#x20;High-Performance&#x20;MoS2&#x20;Thin-Film&#x20;Transistors&#x20;with&#x20;a&#x20;Quasi-2D&#x20;Perovskite&#x20;Oxide&#x20;Dielectric</dcvalue>
<dcvalue element="type" qualifier="none">Article</dcvalue>
<dcvalue element="identifier" qualifier="doi">10.1021&#x2F;acsnano.3c06972</dcvalue>
<dcvalue element="description" qualifier="journalClass">1</dcvalue>
<dcvalue element="identifier" qualifier="bibliographicCitation">ACS&#x20;Nano,&#x20;v.18,&#x20;no.3,&#x20;pp.1958&#x20;-&#x20;1968</dcvalue>
<dcvalue element="citation" qualifier="title">ACS&#x20;Nano</dcvalue>
<dcvalue element="citation" qualifier="volume">18</dcvalue>
<dcvalue element="citation" qualifier="number">3</dcvalue>
<dcvalue element="citation" qualifier="startPage">1958</dcvalue>
<dcvalue element="citation" qualifier="endPage">1968</dcvalue>
<dcvalue element="description" qualifier="isOpenAccess">N</dcvalue>
<dcvalue element="description" qualifier="journalRegisteredClass">scie</dcvalue>
<dcvalue element="description" qualifier="journalRegisteredClass">scopus</dcvalue>
<dcvalue element="identifier" qualifier="wosid">001148238800001</dcvalue>
<dcvalue element="relation" qualifier="journalWebOfScienceCategory">Chemistry,&#x20;Multidisciplinary</dcvalue>
<dcvalue element="relation" qualifier="journalWebOfScienceCategory">Chemistry,&#x20;Physical</dcvalue>
<dcvalue element="relation" qualifier="journalWebOfScienceCategory">Nanoscience&#x20;&amp;&#x20;Nanotechnology</dcvalue>
<dcvalue element="relation" qualifier="journalWebOfScienceCategory">Materials&#x20;Science,&#x20;Multidisciplinary</dcvalue>
<dcvalue element="relation" qualifier="journalResearchArea">Chemistry</dcvalue>
<dcvalue element="relation" qualifier="journalResearchArea">Science&#x20;&amp;&#x20;Technology&#x20;-&#x20;Other&#x20;Topics</dcvalue>
<dcvalue element="relation" qualifier="journalResearchArea">Materials&#x20;Science</dcvalue>
<dcvalue element="type" qualifier="docType">Article</dcvalue>
<dcvalue element="subject" qualifier="keywordPlus">GATE</dcvalue>
<dcvalue element="subject" qualifier="keywordPlus">EXFOLIATION</dcvalue>
<dcvalue element="subject" qualifier="keywordPlus">YIELD</dcvalue>
<dcvalue element="subject" qualifier="keywordPlus">TFTS</dcvalue>
<dcvalue element="subject" qualifier="keywordAuthor">two-dimensional&#x20;materials</dcvalue>
<dcvalue element="subject" qualifier="keywordAuthor">solution&#x20;process</dcvalue>
<dcvalue element="subject" qualifier="keywordAuthor">thin-film&#x20;transistors</dcvalue>
<dcvalue element="subject" qualifier="keywordAuthor">quasi-2Dperovskite&#x20;oxide&#x20;dielectric</dcvalue>
<dcvalue element="subject" qualifier="keywordAuthor">low-temperature&#x20;processing</dcvalue>
</dublin_core>
