<?xml version="1.0" encoding="utf-8" standalone="no"?>
<dublin_core schema="dc">
<dcvalue element="contributor" qualifier="author">김희숙</dcvalue>
<dcvalue element="contributor" qualifier="author">고영표</dcvalue>
<dcvalue element="contributor" qualifier="author">박민</dcvalue>
<dcvalue element="contributor" qualifier="author">김태안</dcvalue>
<dcvalue element="contributor" qualifier="author">손정곤</dcvalue>
<dcvalue element="contributor" qualifier="author">박종혁</dcvalue>
<dcvalue element="contributor" qualifier="author">정승준</dcvalue>
<dcvalue element="contributor" qualifier="author">이상수</dcvalue>
<dcvalue element="date" qualifier="accessioned">2024-01-26T21:19:22Z</dcvalue>
<dcvalue element="date" qualifier="available">2024-01-26T21:19:22Z</dcvalue>
<dcvalue element="date" qualifier="issued">2024-01-09</dcvalue>
<dcvalue element="identifier" qualifier="uri">https:&#x2F;&#x2F;pubs.kist.re.kr&#x2F;handle&#x2F;201004&#x2F;148481</dcvalue>
<dcvalue element="title" qualifier="none">유연&#x20;또는&#x20;탄성&#x20;기판&#x20;접착용&#x20;전도성&#x20;고분자&#x20;복합체&#x20;및&#x20;그의&#x20;제조방법</dcvalue>
<dcvalue element="type" qualifier="none">Patent</dcvalue>
<dcvalue element="date" qualifier="registration">2024-01-09</dcvalue>
<dcvalue element="date" qualifier="application">2019-07-02</dcvalue>
<dcvalue element="identifier" qualifier="patentRegistrationNumber">11866623</dcvalue>
<dcvalue element="identifier" qualifier="patentApplicationNumber">16&#x2F;460237</dcvalue>
<dcvalue element="publisher" qualifier="country">US</dcvalue>
<dcvalue element="type" qualifier="iprs">특허</dcvalue>
<dcvalue element="contributor" qualifier="assignee">한국과학기술연구원</dcvalue>
</dublin_core>
