Ko, Gwan-Jin Kang, Heeseok Han, Won Bae Dutta, Ankan Shin, Jeong-Woong Jang, Tae-Min Han, Sungkeun Lim, Jun Hyeon Eom, Chan-Hwi Choi, So Jeong Ryu, Yelynn Yeo, Woon-Hong Cheng, Huanyu Hwang, Suk-Won 2024-05-16T09:30:15Z 2024-05-16T09:30:15Z 2024-05-16 2024-09 1616-301X https://pubs.kist.re.kr/handle/201004/149851 Effective encapsulation is essential for reliable operation of bio-integrated electronics, particularly those containing dissolvable elements, under humid environments for desired periods of time; however, conventional inorganic or organic encapsulants often suffer from tissue-incompatible mechanical rigidity and insufficient water-barrier performance. Here, a mechanically resilient and efficient encapsulation strategy is proposed that can exceed a functional lifetime of state-of-the-art soft encapsulations by several tens of magnitudes. The exceptional protection arises from the high aspect ratio of dissolvable yet impermeable inorganic fillers embedded within biodegradable polymers, which significantly extend the diffusion length of biofluids or water components. Theoretical modeling and experimental analysis elucidate the effects of types, shapes, and concentrations of the fillers on encapsulation performance, as well as mechanical/physical properties. The operation of electronic components under aqueous solutions for prolonged periods demonstrates the practical feasibility of the encapsulation approach for versatile types of soft, biodegradable electronics. A hybrid composite-based mechanically resilient and extremely efficient encapsulation strategy for soft, biodegradable electronics is developed. Impermeable inorganic fillers, particularly high aspect ratio flakes, embedded within biodegradable polymers significantly slow down water permeation. Theoretical modeling and experimental analysis explore the water-barrier performance, while the extended operation of transient electronic devices with the encapsulation underwater validates the outstanding protective capability. image English John Wiley & Sons Ltd. Materials and Designs for Extremely Efficient Encapsulation of Soft, Biodegradable Electronics Article 10.1002/adfm.202403427 1 Advanced Functional Materials, v.34, no.39 Advanced Functional Materials 34 39 Y scie scopus 001215509100001 2-s2.0-85192434260 Chemistry, Multidisciplinary Chemistry, Physical Nanoscience & Nanotechnology Materials Science, Multidisciplinary Physics, Applied Physics, Condensed Matter Chemistry Science & Technology - Other Topics Materials Science Physics Article TRANSIENT TRANSFORMATION ELASTOMERS WIRELESS biodegradable electronics biodegradable polymer flexible encapsulation hybrid polymer composite transient electronics