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<dublin_core schema="dc">
<dcvalue element="contributor" qualifier="author">Hwang,&#x20;Seongkwon</dcvalue>
<dcvalue element="contributor" qualifier="author">Jang,&#x20;Doojoon</dcvalue>
<dcvalue element="contributor" qualifier="author">Kim,&#x20;Heesuk</dcvalue>
<dcvalue element="contributor" qualifier="author">Kwak,&#x20;Jeonghun</dcvalue>
<dcvalue element="contributor" qualifier="author">Chung,&#x20;Seungjun</dcvalue>
<dcvalue element="date" qualifier="accessioned">2024-05-31T01:00:19Z</dcvalue>
<dcvalue element="date" qualifier="available">2024-05-31T01:00:19Z</dcvalue>
<dcvalue element="date" qualifier="created">2024-05-30</dcvalue>
<dcvalue element="date" qualifier="issued">2024-05</dcvalue>
<dcvalue element="identifier" qualifier="issn">1944-8244</dcvalue>
<dcvalue element="identifier" qualifier="uri">https:&#x2F;&#x2F;pubs.kist.re.kr&#x2F;handle&#x2F;201004&#x2F;149984</dcvalue>
<dcvalue element="description" qualifier="abstract">We&#x20;propose&#x20;a&#x20;novel&#x20;design&#x20;of&#x20;thermoelectric&#x20;(TE)&#x20;effect-based&#x20;soft&#x20;temperature&#x20;sensors&#x20;for&#x20;directly&#x20;monitoring&#x20;localized&#x20;subtle&#x20;temperature&#x20;stimuli.&#x20;This&#x20;design&#x20;integrates&#x20;rheology-engineered&#x20;three-dimensional&#x20;(3D)&#x20;printing&#x20;of&#x20;high-performance&#x20;carbon-based&#x20;TE&#x20;materials&#x20;and&#x20;polymer-based&#x20;viscoelastic&#x20;materials&#x20;with&#x20;low&#x20;thermal&#x20;conductivity.&#x20;Rheological&#x20;engineering&#x20;of&#x20;carbon&#x20;nanotube&#x20;(CNT)&#x20;TE&#x20;inks&#x20;ensures&#x20;the&#x20;3D&#x20;printing&#x20;of&#x20;highly&#x20;sensitive&#x20;TE&#x20;sensing&#x20;units&#x20;on&#x20;directly&#x20;written&#x20;3D&#x20;soft&#x20;platforms.&#x20;Additionally,&#x20;we&#x20;pre-dope&#x20;CNT&#x20;inks&#x20;with&#x20;p-&#x20;and&#x20;n-type&#x20;organic&#x20;dopants&#x20;to&#x20;achieve&#x20;high&#x20;sensitivity&#x20;and&#x20;a&#x20;fast&#x20;response&#x20;to&#x20;temperature&#x20;changes.&#x20;The&#x20;introduced&#x20;3D&#x20;soft&#x20;platforms&#x20;with&#x20;low&#x20;thermal&#x20;conductivity&#x20;lead&#x20;to&#x20;an&#x20;efficient&#x20;thermal&#x20;gradient&#x20;on&#x20;TE&#x20;sensing&#x20;units&#x20;in&#x20;the&#x20;out-of-plane&#x20;direction.&#x20;Furthermore,&#x20;encapsulating&#x20;the&#x20;temperature&#x20;sensor&#x20;array&#x20;with&#x20;the&#x20;same&#x20;polymer-based&#x20;materials&#x20;as&#x20;the&#x20;3D&#x20;soft&#x20;platforms&#x20;facilitates&#x20;independent&#x20;detection&#x20;of&#x20;localized&#x20;temperature&#x20;stimuli&#x20;by&#x20;minimizing&#x20;thermal&#x20;interaction&#x20;between&#x20;sensing&#x20;units,&#x20;resulting&#x20;in&#x20;precise&#x20;temperature&#x20;mapping&#x20;by&#x20;localized&#x20;detection.&#x20;Our&#x20;3D-printed&#x20;soft&#x20;temperature&#x20;sensors&#x20;exhibit&#x20;high&#x20;sensitivity&#x20;to&#x20;relatively&#x20;small&#x20;temperature&#x20;changes,&#x20;with&#x20;a&#x20;minimum&#x20;sensing&#x20;resolution&#x20;of&#x20;0.1&#x20;K&#x20;within&#x20;tens&#x20;of&#x20;milliseconds.&#x20;Moreover,&#x20;the&#x20;temperature&#x20;sensor&#x20;array&#x20;not&#x20;only&#x20;detects&#x20;localized&#x20;temperature&#x20;stimuli&#x20;by&#x20;imaging&#x20;the&#x20;temperature&#x20;distribution&#x20;but&#x20;also&#x20;demonstrates&#x20;remarkable&#x20;mechanical&#x20;reliability&#x20;against&#x20;repetitive&#x20;deformation&#x20;with&#x20;high&#x20;accuracy.</dcvalue>
<dcvalue element="language" qualifier="none">English</dcvalue>
<dcvalue element="publisher" qualifier="none">American&#x20;Chemical&#x20;Society</dcvalue>
<dcvalue element="title" qualifier="none">3D-Printed&#x20;Soft&#x20;Temperature&#x20;Sensors&#x20;Based&#x20;on&#x20;Thermoelectric&#x20;Effects&#x20;for&#x20;Fast&#x20;Mapping&#x20;of&#x20;Localized&#x20;Temperature&#x20;Distributions</dcvalue>
<dcvalue element="type" qualifier="none">Article</dcvalue>
<dcvalue element="identifier" qualifier="doi">10.1021&#x2F;acsami.4c04021</dcvalue>
<dcvalue element="description" qualifier="journalClass">1</dcvalue>
<dcvalue element="identifier" qualifier="bibliographicCitation">ACS&#x20;Applied&#x20;Materials&#x20;&amp;&#x20;Interfaces,&#x20;v.16,&#x20;no.19,&#x20;pp.25071&#x20;-&#x20;25079</dcvalue>
<dcvalue element="citation" qualifier="title">ACS&#x20;Applied&#x20;Materials&#x20;&amp;&#x20;Interfaces</dcvalue>
<dcvalue element="citation" qualifier="volume">16</dcvalue>
<dcvalue element="citation" qualifier="number">19</dcvalue>
<dcvalue element="citation" qualifier="startPage">25071</dcvalue>
<dcvalue element="citation" qualifier="endPage">25079</dcvalue>
<dcvalue element="description" qualifier="isOpenAccess">N</dcvalue>
<dcvalue element="description" qualifier="journalRegisteredClass">scie</dcvalue>
<dcvalue element="description" qualifier="journalRegisteredClass">scopus</dcvalue>
<dcvalue element="identifier" qualifier="wosid">001227641000001</dcvalue>
<dcvalue element="identifier" qualifier="scopusid">2-s2.0-85192240979</dcvalue>
<dcvalue element="relation" qualifier="journalWebOfScienceCategory">Nanoscience&#x20;&amp;&#x20;Nanotechnology</dcvalue>
<dcvalue element="relation" qualifier="journalWebOfScienceCategory">Materials&#x20;Science,&#x20;Multidisciplinary</dcvalue>
<dcvalue element="relation" qualifier="journalResearchArea">Science&#x20;&amp;&#x20;Technology&#x20;-&#x20;Other&#x20;Topics</dcvalue>
<dcvalue element="relation" qualifier="journalResearchArea">Materials&#x20;Science</dcvalue>
<dcvalue element="type" qualifier="docType">Article</dcvalue>
<dcvalue element="subject" qualifier="keywordPlus">POWER</dcvalue>
<dcvalue element="subject" qualifier="keywordAuthor">soft&#x20;temperature&#x20;sensors</dcvalue>
<dcvalue element="subject" qualifier="keywordAuthor">3D&#x20;printing</dcvalue>
<dcvalue element="subject" qualifier="keywordAuthor">thermoelectrics</dcvalue>
<dcvalue element="subject" qualifier="keywordAuthor">carbon&#x20;nanotubes</dcvalue>
<dcvalue element="subject" qualifier="keywordAuthor">localized&#x20;temperature&#x20;sensing</dcvalue>
</dublin_core>
