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<dublin_core schema="dc">
<dcvalue element="contributor" qualifier="author">Lee,&#x20;Dongsu</dcvalue>
<dcvalue element="contributor" qualifier="author">Kim,&#x20;Dong&#x20;Hwi</dcvalue>
<dcvalue element="contributor" qualifier="author">Kim,&#x20;Hyungyong</dcvalue>
<dcvalue element="contributor" qualifier="author">Seung,&#x20;Hong&#x20;Min</dcvalue>
<dcvalue element="contributor" qualifier="author">Song,&#x20;Hyun-Cheol</dcvalue>
<dcvalue element="contributor" qualifier="author">Kim,&#x20;Miso</dcvalue>
<dcvalue element="date" qualifier="accessioned">2024-06-28T08:30:05Z</dcvalue>
<dcvalue element="date" qualifier="available">2024-06-28T08:30:05Z</dcvalue>
<dcvalue element="date" qualifier="created">2024-06-28</dcvalue>
<dcvalue element="date" qualifier="issued">2024-08</dcvalue>
<dcvalue element="identifier" qualifier="issn">1359-8368</dcvalue>
<dcvalue element="identifier" qualifier="uri">https:&#x2F;&#x2F;pubs.kist.re.kr&#x2F;handle&#x2F;201004&#x2F;150154</dcvalue>
<dcvalue element="description" qualifier="abstract">Flexible&#x20;ceramic&#x20;composites&#x20;are&#x20;promising&#x20;candidates&#x20;in&#x20;capacitive&#x20;pressure&#x20;sensing&#x20;applications.&#x20;However,&#x20;the&#x20;fabrication&#x20;of&#x20;complex&#x20;composite&#x20;structures&#x20;typically&#x20;involves&#x20;costly&#x20;and&#x20;time-consuming&#x20;processes&#x20;such&#x20;as&#x20;lithography&#x20;or&#x20;mold&#x20;utilization.&#x20;Digital&#x20;light&#x20;processing&#x20;(DLP)-based&#x20;3D&#x20;printing&#x20;offers&#x20;a&#x20;layer-by-layer&#x20;approach&#x20;via&#x20;photopolymerization,&#x20;facilitating&#x20;rapid&#x20;prototyping&#x20;of&#x20;various&#x20;ceramic&#x20;composite&#x20;structures&#x20;in&#x20;a&#x20;single-step&#x20;synthesis&#x20;process.&#x20;This&#x20;study&#x20;presents&#x20;the&#x20;successful&#x20;implementation&#x20;of&#x20;a&#x20;flexible&#x20;ceramic&#x20;composite&#x20;based&#x20;on&#x20;the&#x20;highly&#x20;dielectric&#x20;ceramic&#x20;BaTiO3&#x20;and&#x20;conductive&#x20;MWCNT&#x20;fillers&#x20;by&#x20;employing&#x20;DLP&#x20;3D&#x20;printing&#x20;to&#x20;create&#x20;an&#x20;hourglass-shaped&#x20;stress&#x20;concentration&#x20;structure,&#x20;aiming&#x20;at&#x20;enhancing&#x20;flexible&#x20;capacitive&#x20;sensing&#x20;capabilities.&#x20;Blending&#x20;commercial&#x20;flexible&#x20;resin&#x20;with&#x20;4-acryloyl&#x20;morpholine&#x20;monomers&#x20;yields&#x20;a&#x20;photocurable&#x20;resin&#x20;formulation&#x20;with&#x20;appropriate&#x20;mechanical&#x20;flexibility,&#x20;photocurability,&#x20;and&#x20;optimal&#x20;suspension&#x20;viscosity&#x20;suitable&#x20;for&#x20;DLP&#x20;3D&#x20;printing.&#x20;Furthermore,&#x20;the&#x20;proposed&#x20;3D-printed&#x20;sensor&#x20;arrays&#x20;comprising&#x20;hourglass-shaped&#x20;unit&#x20;cells&#x20;demonstrate&#x20;improved&#x20;linear&#x20;sensitivity&#x20;across&#x20;a&#x20;broad&#x20;pressure&#x20;range&#x20;owing&#x20;to&#x20;efficient&#x20;stress&#x20;concentration&#x20;effects&#x20;in&#x20;a&#x20;symmetric&#x20;geometry,&#x20;as&#x20;corroborated&#x20;by&#x20;both&#x20;finite&#x20;element&#x20;methods&#x20;and&#x20;experiments.&#x20;DLP&#x20;3D&#x20;printing,&#x20;combined&#x20;with&#x20;tailored&#x20;resin&#x20;formulations&#x20;and&#x20;optimized&#x20;ceramic&#x20;and&#x20;conductive&#x20;filler&#x20;contents,&#x20;enables&#x20;the&#x20;rapid&#x20;prototyping&#x20;of&#x20;diverse&#x20;sensor&#x20;structures&#x20;with&#x20;significantly&#x20;enhanced&#x20;sensitivity,&#x20;highlighting&#x20;the&#x20;versatility&#x20;of&#x20;this&#x20;approach&#x20;for&#x20;a&#x20;wide&#x20;range&#x20;of&#x20;applications.</dcvalue>
<dcvalue element="language" qualifier="none">English</dcvalue>
<dcvalue element="publisher" qualifier="none">Pergamon&#x20;Press&#x20;Ltd.</dcvalue>
<dcvalue element="title" qualifier="none">Engineering&#x20;digital&#x20;light&#x20;processing&#x20;ceramic&#x20;composites&#x20;for&#x20;wide-range&#x20;flexible&#x20;sensing&#x20;arrays</dcvalue>
<dcvalue element="type" qualifier="none">Article</dcvalue>
<dcvalue element="identifier" qualifier="doi">10.1016&#x2F;j.compositesb.2024.111595</dcvalue>
<dcvalue element="description" qualifier="journalClass">1</dcvalue>
<dcvalue element="identifier" qualifier="bibliographicCitation">Composites&#x20;Part&#x20;B:&#x20;Engineering,&#x20;v.283</dcvalue>
<dcvalue element="citation" qualifier="title">Composites&#x20;Part&#x20;B:&#x20;Engineering</dcvalue>
<dcvalue element="citation" qualifier="volume">283</dcvalue>
<dcvalue element="description" qualifier="isOpenAccess">N</dcvalue>
<dcvalue element="description" qualifier="journalRegisteredClass">scie</dcvalue>
<dcvalue element="description" qualifier="journalRegisteredClass">scopus</dcvalue>
<dcvalue element="identifier" qualifier="wosid">001249618200001</dcvalue>
<dcvalue element="identifier" qualifier="scopusid">2-s2.0-85194716452</dcvalue>
<dcvalue element="relation" qualifier="journalWebOfScienceCategory">Engineering,&#x20;Multidisciplinary</dcvalue>
<dcvalue element="relation" qualifier="journalWebOfScienceCategory">Materials&#x20;Science,&#x20;Composites</dcvalue>
<dcvalue element="relation" qualifier="journalResearchArea">Engineering</dcvalue>
<dcvalue element="relation" qualifier="journalResearchArea">Materials&#x20;Science</dcvalue>
<dcvalue element="type" qualifier="docType">Article</dcvalue>
<dcvalue element="subject" qualifier="keywordPlus">PRESSURE&#x20;SENSOR</dcvalue>
<dcvalue element="subject" qualifier="keywordPlus">ELECTRODES</dcvalue>
<dcvalue element="subject" qualifier="keywordPlus">PERFORMANCE</dcvalue>
<dcvalue element="subject" qualifier="keywordAuthor">Dielectric</dcvalue>
<dcvalue element="subject" qualifier="keywordAuthor">Ceramic&#x20;composite</dcvalue>
<dcvalue element="subject" qualifier="keywordAuthor">Flexible&#x20;sensor</dcvalue>
<dcvalue element="subject" qualifier="keywordAuthor">Digital&#x20;light&#x20;processing</dcvalue>
</dublin_core>
