Dharmaiah, Peyala Heo, Minsu Nagarjuna, Cheenepalli Jung, Sung-Jin Won, Sung Ok Lee, Kyu Hyoung Kim, Seong Keun Kim, Jin-Sang Ahn, Byungmin Kim, Hyun-Sik Baek, Seung-Hyub 2024-08-23T09:00:09Z 2024-08-23T09:00:09Z 2024-08-22 2024-11 0925-8388 https://pubs.kist.re.kr/handle/201004/150481 To meet the growing demand for thermoelectric devices operating in intermediate temperature ranges, it is essential to develop high-performance materials with superior thermoelectric properties and robust mechanical strength. In this study, we systematically optimized carrier concentration by introducing acceptor impurities into ZnSb materials. Our results demonstrate that doping Cu into the Zn site effectively modulates hole carrier concentration, leading to a substantial enhancement in electrical conductivity and a remarkable improvement in power factor (107 %). Consequently, we achieved a high peak ZT of 1.04 at 600 K and an average ZTave value of 0.63 within the temperature range of 300-600 K. This yielded a calculated efficiency of eta max = 7 % at Delta T = 300 K, for the Zn0.99Cu0.01Sb sample, which is 134 % higher than that of the pristine ZnSb sample (eta max = 2.98 %). Moreover, the superior hardness and fracture toughness (KIC) of ZnSb samples compared to other stateof-the-art thermoelectric materials make them highly desirable for real-time applications. English Elsevier BV Enhancement of thermoelectric properties in p-type ZnSb alloys through Cu-doping Article 10.1016/j.jallcom.2024.175739 1 Journal of Alloys and Compounds, v.1004 Journal of Alloys and Compounds 1004 Y scie scopus 001288634300001 2-s2.0-85200124901 Chemistry, Physical Materials Science, Multidisciplinary Metallurgy & Metallurgical Engineering Chemistry Materials Science Metallurgy & Metallurgical Engineering Article IMPURITY FIGURE MERIT Thermoelectric materials ZnSb alloys Charge carrier concentration optimization Power factor Mechanical performance