Hossain, Md. Monir Kim, Young-Kyeong Lim, Hongjin Lim, Ik Jae Joo, Yongbi Jeong, Hyeon-Dam Kim, Jaeho Islam, Md. Akherul Kim, Dongwon Cho, Hyunjin Hahn, Jae Ryang Jang, Se Gyu 2024-10-04T00:30:16Z 2024-10-04T00:30:16Z 2024-10-02 2024-11 1944-8244 https://pubs.kist.re.kr/handle/201004/150699 Industrial implementation of highly thermally conductive polymeric composites has been hindered by several hurdles, such as the low intrinsic thermal conductivity (TC) of polymers, the use of expensive thermally conductive fillers, and difficulty in processing composites with high filler loading. In this study, we introduce a straightforward fabrication method for a high TC polymeric composite with a programmed internal structure of a highly interconnected thermal conduction highway (HITCH) by the simple addition of partially cured resin fragments into the conventional filler/resin combination. Critical variables, such as the concentration of the added resin fragments and the local concentration of hexagonal boron nitride (hBN) in the HITCH, as well as the packing density of the fragments, were systematically tuned to maximize the TC with the use of the least amount of the filler. Careful choice of the compositions enabled a significant TC enhancement of the composite by 2.6 times (6.5 W/mK) compared to the value of the conventional composite at the same overall concentration of hBN (similar to 2.5 W/mK). Finally, a composite with high TC (similar to 12 W/mK) and strong tensile strength (similar to 22.6 MPa), which is good enough for most practical thermal management applications, could be successfully fabricated with the use of the least amount of the filler (similar to 34 wt %). The comprehensive study of the HITCH composite here can be easily extended to other combinations with various fillers and matrices and may provide a library to researchers looking for advanced materials for future thermal management systems. English American Chemical Society Highly Interconnected Thermal Conduction Highway for Highly Thermally Conductive and Mechanically Strong Polymeric Composites Article 10.1021/acsami.4c13986 1 ACS Applied Materials & Interfaces, v.16, no.47, pp.65307 - 65318 ACS Applied Materials & Interfaces 16 47 65307 65318 N scie scopus 001319874700001 Nanoscience & Nanotechnology Materials Science, Multidisciplinary Science & Technology - Other Topics Materials Science Article LIQUID-CRYSTALLINE EPOXY RESIN MANAGEMENT INTERFACE NETWORK DESIGN FILLER thermal management liquid crystalline epoxy resin polymer composite heat conduction network thermal conductivity