Kim, Doyoung Ryu, Seong Bae, Sukang Lee, Min Wook Kim, Tae-Wook Bae, Jong-Seong Park, Jiwon Lee, Seoung-Ki 2025-01-02T02:30:16Z 2025-01-02T02:30:16Z 2024-12-30 2024-12 https://pubs.kist.re.kr/handle/201004/151444 The rapid evolution of microelectronics and display technologies has driven the demand for advanced manufacturing techniques capable of precise, high-speed microchip transfer. As devices shrink in size and increase in complexity, scalable and contactless methods for microscale placement are essential. Laser-induced forward transfer (LIFT) has emerged as a transformative solution, offering the precision and adaptability required for next-generation applications such as micro-light-emitting diodes (mu-LEDs). This study optimizes the LIFT process for the precise transfer of silicon microchips designed to mimic mu-LEDs. Critical parameters, including laser energy density, laser pulse width, and dynamic release layer (DRL) thickness are systematically adjusted to ensure controlled blister formation, a key factor for successful material transfer. The DRL, a polyimide-based photoreactive layer, undergoes photothermal decomposition under 355 nm laser irradiation, creating localized pressure that propels microchips onto the receiver substrate in a contactless manner. Using advanced techniques such as three-dimensional profilometry, X-ray photoelectron spectroscopy, and ultrafast imaging, this study evaluates the rupture dynamics of the DRL and the velocity of microchips during transfer. Optimization of the DRL thickness to 1 mu m and a transfer velocity of 20 m s(-)1 achieves a transfer yield of up to 97%, showcasing LIFT's potential in mu-LED manufacturing and semiconductor production. English MDPI Dynamics of Blister Actuation in Laser-Induced Forward Transfer for Contactless Microchip Transfer Article 10.3390/nano14231926 1 Nanomaterials, v.14, no.23 Nanomaterials 14 23 Y scie scopus 001376535500001 2-s2.0-85212218357 Chemistry, Multidisciplinary Nanoscience & Nanotechnology Materials Science, Multidisciplinary Physics, Applied Chemistry Science & Technology - Other Topics Materials Science Physics Article POLYIMIDE STIFFNESS ABLATION FILMS laser-induced forward transfer micro-light-emitting diode blister actuation contactless transfer microchip