Kang, Yeojin Park, Wonjung Yoo, Dayoung Won, Kyung-Ah Lee, Seung-Gun Kim, Jong-Man Kim, Yangdo Lee, Dongyun 2025-07-18T07:00:49Z 2025-07-18T07:00:49Z 2025-07-18 2025-06 2156-3950 https://pubs.kist.re.kr/handle/201004/152794 This study investigates the adhesion properties of electroless copper (Cu) plated on glass-reinforced epoxy-based build-up films [Ajinomoto Build-Up Film (ABF)] using nanoindentation techniques. The adhesion strength was quantified through critical load measurements in scratch tests, revealing critical loads of approximately 19.7 mN for chemical-U and 13.3mN for chemical-A, corresponding to adhesion strengths of 0.46 and 0.16 kgf/cm, respectively. Microscopic analysis confirmed uniform Cu distribution at the interface within the first minute of deposition, with notable differences in mechanical properties between the two plating chemicals. The study highlights the importance of epoxy exposure control via the desmear process, which significantly enhances ABF/Cu adhesion by expanding the contact area. Additionally, the role of the pegging effect and chemical bonding (C-O bond formation) in improving adhesion is emphasized. These findings provide valuable insights into optimizing the interfacial adhesion of ABF/Cu systems for advanced microelectronic applications. English Institute of Electrical and Electronics Engineers Inc. Evaluating the Adhesive Properties of Electroless Cu on Glass-Reinforced Epoxy-Based Build-Up Dielectric Films via Nanoindentation Article 10.1109/TCPMT.2025.3567314 1 IEEE Transactions on Components, Packaging and Manufacturing Technology, v.15, no.6, pp.1344 - 1350 IEEE Transactions on Components, Packaging and Manufacturing Technology 15 6 1344 1350 N scie scopus 001519804400021 Engineering, Manufacturing Engineering, Electrical & Electronic Materials Science, Multidisciplinary Engineering Materials Science Article SURFACE MODIFICATION SUBSTRATE IMPROVEMENT MORPHOLOGY COPPER LAYERS Adhesives Films Surface treatment Surface morphology Plating Copper Chemicals Substrates Surface roughness Rough surfaces Adhesive properties dielectric build-up films electroless deposition epoxy-copper (Cu) interface nanoindentation scratch test