<?xml version="1.0" encoding="utf-8" standalone="no"?>
<dublin_core schema="dc">
<dcvalue element="contributor" qualifier="author">Kim,&#x20;Ji&#x20;Eun</dcvalue>
<dcvalue element="contributor" qualifier="author">Chun,&#x20;Suk&#x20;Yeop</dcvalue>
<dcvalue element="contributor" qualifier="author">Soh,&#x20;Keunho</dcvalue>
<dcvalue element="contributor" qualifier="author">Yoon,&#x20;Jung&#x20;Ho</dcvalue>
<dcvalue element="date" qualifier="accessioned">2025-12-29T05:00:15Z</dcvalue>
<dcvalue element="date" qualifier="available">2025-12-29T05:00:15Z</dcvalue>
<dcvalue element="date" qualifier="created">2025-11-19</dcvalue>
<dcvalue element="date" qualifier="issued">2025-03</dcvalue>
<dcvalue element="identifier" qualifier="uri">https:&#x2F;&#x2F;pubs.kist.re.kr&#x2F;handle&#x2F;201004&#x2F;153897</dcvalue>
<dcvalue element="description" qualifier="abstract">Memristors&#x20;are&#x20;promising&#x20;next-generation&#x20;devices&#x20;due&#x20;to&#x20;their&#x20;energy&#x20;efficiency&#x20;and&#x20;high&#x20;data&#x20;processing&#x20;capabilities.&#x20;Recent&#x20;studies&#x20;have&#x20;extensively&#x20;reported&#x20;using&#x20;memristors&#x20;to&#x20;mimic&#x20;the&#x20;human&#x20;sensory&#x20;system&#x20;and&#x20;function&#x20;as&#x20;versatile&#x20;simulation&#x20;platforms&#x20;for&#x20;artificial&#x20;intelligence&#x20;applications.&#x20;This&#x20;review&#x20;explores&#x20;the&#x20;development&#x20;of&#x20;high-performance&#x20;memristors&#x20;incorporating&#x20;oxide&#x20;nanorods&#x20;and&#x20;their&#x20;applications&#x20;in&#x20;mimicking&#x20;the&#x20;human&#x20;sensory&#x20;system&#x20;and&#x20;advanced&#x20;computing.</dcvalue>
<dcvalue element="language" qualifier="none">English</dcvalue>
<dcvalue element="publisher" qualifier="none">IEEE</dcvalue>
<dcvalue element="title" qualifier="none">Nanorods-based&#x20;Memristors&#x20;:&#x20;Advancing&#x20;Bio-inspired&#x20;System&#x20;and&#x20;Neuromorphic&#x20;Computing</dcvalue>
<dcvalue element="type" qualifier="none">Conference</dcvalue>
<dcvalue element="identifier" qualifier="doi">10.1109&#x2F;EDTM61175.2025.11041471</dcvalue>
<dcvalue element="description" qualifier="journalClass">1</dcvalue>
<dcvalue element="identifier" qualifier="bibliographicCitation">9th&#x20;Electron&#x20;Devices&#x20;Technology&#x20;and&#x20;Manufacturing&#x20;Conference-EDTM-Annual</dcvalue>
<dcvalue element="citation" qualifier="title">9th&#x20;Electron&#x20;Devices&#x20;Technology&#x20;and&#x20;Manufacturing&#x20;Conference-EDTM-Annual</dcvalue>
<dcvalue element="citation" qualifier="conferencePlace">HK</dcvalue>
<dcvalue element="citation" qualifier="conferencePlace">Hong&#x20;Kong,&#x20;PEOPLES&#x20;R&#x20;CHINA</dcvalue>
<dcvalue element="citation" qualifier="conferenceDate">2025-03-09</dcvalue>
<dcvalue element="relation" qualifier="isPartOf">2025&#x20;9TH&#x20;IEEE&#x20;ELECTRON&#x20;DEVICES&#x20;TECHNOLOGY&#x20;&amp;&#x20;MANUFACTURING&#x20;CONFERENCE,&#x20;EDTM</dcvalue>
<dcvalue element="identifier" qualifier="wosid">001540468800388</dcvalue>
<dcvalue element="identifier" qualifier="scopusid">2-s2.0-105010813847</dcvalue>
</dublin_core>
