Kim, Minji Choi, Hyeseo Oh, Hyun Ju Na, Wonjin Eom, Youngho 2026-02-19T06:30:30Z 2026-02-19T06:30:30Z 2026-02-19 2026-03 0935-9648 https://pubs.kist.re.kr/handle/201004/154324 Extensive efforts have been made to fabricate complex 3D thermal management materials from hexagonal boron nitride (h-BN) using 3D printing and templating. However, these techniques are often energy-intensive, time-consuming, and inherently limited in scalability, owing to prolonged processing times and low throughput. Herein, we report a cold, rapid, and scalable stamping approach for constructing intricate, large-area h-BN-based thermal architectures. This strategy relies on forming highly viscoelastic h-BN doughs achieved through developing a para-aramid (p-aramid) fiber network and densification via a bimodal alumina mixture. The p-aramid network maximizes viscoelasticity with a minimal binder content (5.1 wt.%), enabling the doughs to exhibit pronounced plasticity during stamping while maintaining solid-like behavior after relaxation. Consequently, the doughs conform precisely to complex stamp geometries within 2 s under ambient conditions, preserving their high structural integrity. Scalability is demonstrated by stamping various 3D geometries exceeding 10 cm, including cubes, cylinders, annular sectors, and honeycombs. Furthermore, the fiber-reinforced structures exhibit enhanced thermal conductivity (TC) and fatigue resistance under extreme temperatures (− 50°C and 200°C). Notably, the resulting architectures substantially improve the TC of the polymer composites when used as internal frameworks. This low-energy stamping strategy represents a paradigm shift in the processing of advanced thermal materials. English WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim Cold, Rapid, and Scalable Stamping of Aramid-Networked Viscoelastic h-BN Doughs for Complex Thermal Architectures Article 10.1002/adma.202512454 1 Advanced Materials, v.38, no.14 Advanced Materials 38 14 N scie scopus 2-s2.0-105029460442 Chemistry, Multidisciplinary Chemistry, Physical Nanoscience & Nanotechnology Materials Science, Multidisciplinary Physics, Applied Physics, Condensed Matter Chemistry Science & Technology - Other Topics Materials Science Physics Article; Early Access 3D thermal management materials rapid cold stamping viscoelastic dough h-BN composites p-aramid fiber