Jung, Haksoon Choi, Joonghoon Baek, Seunghun Shin, Bong Gyu Song, Young Jae Jung, Hanggyo Kim, JoHyeon Jeon, Jongwook Kim, Gyumin Park, Heechun Lee, Yeonjoo Yoo, Jinkyoung Lee, Jae-Hyun Kim, Hyungwoo Kang, Kibum Jeong, Jaeyong Kim, Sang Hyeon Bae, Joohan Kim, Chang Soo Yang, Won Kwang Lee, Sungjoo Kwon, Jiwook Kim, Byung-Sung Han, Jae-Hoon Kim, Hyung-Jun Yoon, Hoon Hahn Kwon, Jimin Hong, Young Joon 2026-03-27T06:30:15Z 2026-03-27T06:30:15Z 2026-03-24 2026-03 1936-0851 https://pubs.kist.re.kr/handle/201004/154503 The emergence of ultralarge-scale hardware systems for artificial intelligence is driving demand for high-performance heterogeneous integration. At the heart of these systems lies the maximization of computational capability through high data bandwidth, necessitating interconnects that either increase the number of links between tiers and chips or enhance the data transfer rate of each link. Monolithic three-dimensional (M3D) integration, particularly with two-dimensional (2D) materials, offers ultradense intertier vias and multifunctional devices within back-end-of-line-compatible processes, enabling compact vertical stacking of logic and memory. A critical challenge in this architecture is thermal management, requiring cross-layer electro-thermal analysis and codesign with integrated power regulation. In parallel, photonic integrated circuits provide low-latency, energy-efficient interchip communication by overcoming the traditional bandwidth limitation imposed by electrical signal loss, and their advantages become increasingly significant as the communication distance increases. Emerging concepts, including spectrally tunable 2D photodetectors and vertically stacked microlight-emitting-diode–photodiode transceivers, further enhance scalability by eliminating reliance on external lasers. This Review article highlights the convergence of M3D integration, 2D materials, and photonic interconnects, while outlining challenges of material compatibility, process scalability, and system-level codesign that must be addressed to realize a unified framework for next-generation computing and communication systems beyond conventional Si scaling. English American Chemical Society Advances and Future Challenges in Monolithic 3D Integrated Logic, Power, and Optoelectronics Technologies for Tightly Interconnected Intelligent Systems Article 10.1021/acsnano.5c15601 1 ACS Nano, v.20, no.8, pp.6407 - 6445 ACS Nano 20 8 6407 6445 N scie scopus 001694431500001 2-s2.0-105031673907 Chemistry, Multidisciplinary Chemistry, Physical Nanoscience & Nanotechnology Materials Science, Multidisciplinary Chemistry Science & Technology - Other Topics Materials Science Review ATOMIC LAYER DEPOSITION 2-DIMENSIONAL MATERIALS SILICON INTERPOSER ANALYTICAL PLACEMENT DESIGN METHODOLOGY MOS2 TRANSISTORS MICRO-LEDS PERFORMANCE PHOTONICS LIGHT-EMITTING-DIODES copackaged optics optical interconnects photonicintegrated circuits design-technology co-optimization power delivery network thermal management 2D materials microlight-emitting diodes heterogeneously integratedmonolithic 3D advanced packaging