Park, HyungDal Choi, Won suk Oh, SungHwan Kim, Joohee Kwak, Sung Soo Kim, Yong-Jun Seok, Seonho KIM, JIN SEOK 2024-01-12T02:47:01Z 2024-01-12T02:47:01Z 2023-11-13 2023-03-22 https://pubs.kist.re.kr/handle/201004/76478 This paper presents measurement and FEM (Finite Element Method) analysis of metal thin-film adhesion to parylene substrate for neural electrodes. A test sample was composed of patterned metal thin-films with 300 nm-thick gold and 30 nm-thick titanium on top of parylene substrate. To improve adhesion, CF4-based plasma treatment was applied before metal thin-film deposition. The adhesion was measured with the scotch tape test. Force exerted on the scotch tape was recorded as the function of displacement of the scotch tape. It was found that a peak was created in the measured force-displacement curve due to metal delamination. Metal thin-film adhesion was estimated 1.3 J/m2 by referring to the force peak and metal width at the force-displacement curve. Besides, the scotch tape test was simulated to comprehend the delamination behavior of the test through FEM modeling. Korean (사)마이크로나노시스템학회 Analysis of metal thin-film adhesion to parylene substrate for neural electrodes using tape test 테이프 테스트를 이용한 신경전극용 Parylene 기판과 금속박막의 접착력 분석 Conference 2 2023년, 제25회 한국 MEMS학술대회 (The 25th Korean MEMS Conference) 2023년, 제25회 한국 MEMS학술대회 (The 25th Korean MEMS Conference) KO 제주 부영호텔 2023-03-22 2023년, 제25회 한국 MEMS학술대회