Lee, Myung Jae 2024-01-12T05:42:55Z 2024-01-12T05:42:55Z 2022-01-14 2018-09-10 https://pubs.kist.re.kr/handle/201004/79066 IIAE Chip on Chip Bonding Technology for Fine Pitch Connection With Al-Si/TiN Bumps Conference 1 IIAE International Conference on Intelligent Systems and Image Processing IIAE International Conference on Intelligent Systems and Image Processing JA IIAE