Lee, Myung Jae 2024-01-12T06:15:13Z 2024-01-12T06:15:13Z 2022-01-14 2016-09-13 https://pubs.kist.re.kr/handle/201004/79579 Japan Society Applied Physics Evaluation of Resister and Diode Characteristics for Chip on Chip Bonding Using "AlSi/TiN" Bumps and Concave Shape Electrode With ACP Conference 1 Japan Society of Applied Physics Autumn Meeting Japan Society of Applied Physics Autumn Meeting JA Japan Society Applied Physics