Lee, Myung Jae 2024-01-12T06:16:24Z 2024-01-12T06:16:24Z 2022-01-14 2016-01-23 https://pubs.kist.re.kr/handle/201004/79634 Technical College Symposium Evaluation of the Three-Dimensional Mounting of the Integrated Circuit Using ACP Conference 1 Technical College Symposium Technical College Symposium JA Technical College Symposium