Lee, Seung-Yong Lee, Ji Yeong Lee, Sang-In Shim, Jae-Hyeok 2024-01-12T06:33:24Z 2024-01-12T06:33:24Z 2023-11-01 2023-10 1044-5803 https://pubs.kist.re.kr/handle/201004/79796 Cu precipitation behavior of a Cr-Ni-Mn austenitic stainless steel containing a small amount of Cu during aging between 923 and 1023 K for up to 24 h was investigated by atom probe tomography with cluster-finding and interfacial segregation analyses. At 923 K, Cu precipitation started at 20 min of aging, forming uniformly dispersed nano-sized precipitates and the number density of precipitates reached the maximum at 2 h of aging, although the volume fraction of precipitates continued to increase with increasing aging time up to 24 h. The precipitate size steadily increased with increasing aging time and temperature. The growth rate of Cu precipitates observed in this study is significantly lower than that in previous studies of other austenitic stainless steels, although the isothermal growth behavior obeys Lifshitz-Slyozov-Wagner theory. It was noted that both Ni and Mn were enriched near precipitate/matrix interfaces, reducing the interfacial energy as a result. This interfacial segregation seems to effectively reduce the growth rate of Cu precipitates during aging, which was significantly lower than that reported for other austenitic steels. English Elsevier BV Atom probe tomography study of Cu precipitation behavior in 22Cr-13Ni-5Mn austenitic stainless steel Article 10.1016/j.matchar.2023.113231 1 Materials Characterization, v.204 Materials Characterization 204 N scie scopus 001097811000001 Materials Science, Multidisciplinary Metallurgy & Metallurgical Engineering Materials Science, Characterization & Testing Materials Science Metallurgy & Metallurgical Engineering Article FE-CU COPPER NI Austenitic stainless steel Cu precipitate Atomic probe tomography Interfacial segregation