MUN JOONG HWA Kim, Ki Bae Seok, Hyun Kwang Sungbin Kim Youngdo Kim 2024-01-12T08:16:56Z 2024-01-12T08:16:56Z 2021-09-29 2005-07 https://pubs.kist.re.kr/handle/201004/82027 English Semi-solid forming Rheology Thixotropiy Viscosity Filling behavior Mg alloy Computer Simulation for Die Filling Behavior of Semi-Solid Slurry of Mg Alloy Conference 1 Proceedings of the 2nd Japan-Korea Workshop for Young Foundry Engineers, pp.267 - 269 Proceedings of the 2nd Japan-Korea Workshop for Young Foundry Engineers 267 269 KO