Sim, W. Kim, B. Choi, B. Park, J.-O. 2024-01-12T09:16:14Z 2024-01-12T09:16:14Z 2022-03-07 2002-04 0000-0000 https://pubs.kist.re.kr/handle/201004/83298 In this study, the finite-element method(FEM) is employed in order to analyze the mechanical behavior of parylene diaphragm. Thermal and load-deflection FE analyses of flat and corrugated parylene diaphragm are performed to find an effect of the residual stress on the stiffness of the diaphragm. The simulation results show that the mechanical sensitivity of diaphragm is greatly influenced by the residual stress caused by the thermal process(silicon wet etching). The measurement is consistent with simulation result that takes the effect of residual stress into account. Optimum shape of corrugated diaphragm that considers the corrugation depth and number is determined. English IEEE Thermal and load-deflection FE analysis of parylene diaphragms Conference 1 2002 International Conference on Modeling and Simulation of Microsystems - MSM 2002, pp.210 - 213 2002 International Conference on Modeling and Simulation of Microsystems - MSM 2002 210 213 US San Juan 2002-04-21 2002 International Conference on Modeling and Simulation of Microsystems - MSM 2002 2-s2.0-3843148522