Kim, Yong Tae 2024-01-12T09:42:25Z 2024-01-12T09:42:25Z 2022-01-14 2001-04-16 https://pubs.kist.re.kr/handle/201004/83858 A method of improving dielectric constant and adhesion strength of methysilsesquioxyane by using a NH3 plasma treatment Conference 1 , pp.231 - 0 231 0 Material Reserch Society