Kim, Yong Tae 2024-01-12T10:10:59Z 2024-01-12T10:10:59Z 2022-01-14 2000-07-24 https://pubs.kist.re.kr/handle/201004/84351 Enhancement of the electrical and physical properties of Cu/W-N/HSQ interconnection scheme by NH3 plasma treatment Conference 1 , pp.0 0 0 ICEE2K Proc