<?xml version="1.0" encoding="utf-8" standalone="no"?>
<dublin_core schema="dc">
<dcvalue element="contributor" qualifier="author">Jeong,&#x20;Jeung&#x20;hyun</dcvalue>
<dcvalue element="date" qualifier="accessioned">2024-01-12T10:42:43Z</dcvalue>
<dcvalue element="date" qualifier="available">2024-01-12T10:42:43Z</dcvalue>
<dcvalue element="date" qualifier="created">2022-01-14</dcvalue>
<dcvalue element="date" qualifier="issued">1999-01-01</dcvalue>
<dcvalue element="identifier" qualifier="uri">https:&#x2F;&#x2F;pubs.kist.re.kr&#x2F;handle&#x2F;201004&#x2F;84980</dcvalue>
<dcvalue element="title" qualifier="none">Analysis&#x20;of&#x20;reliability&#x20;of&#x20;thin-film&#x20;materials&#x20;for&#x20;microelectronic&#x20;components</dcvalue>
<dcvalue element="type" qualifier="none">Conference</dcvalue>
<dcvalue element="description" qualifier="journalClass">1</dcvalue>
<dcvalue element="relation" qualifier="isPartOf">The&#x20;Korea-U.S.&#x20;Materials&#x20;Symposium</dcvalue>
</dublin_core>
