Jeong, Jeung hyun 2024-01-12T11:39:29Z 2024-01-12T11:39:29Z 2022-01-14 1996-01-01 https://pubs.kist.re.kr/handle/201004/85947 Quantitative evaluation of interface adhesion in DLC film/metal system through the analysis Conference 1 The 2nd Korea-Japan Symposium on Plasma and Thin Film Technology