Kim, Yong Tae 2024-01-12T11:41:14Z 2024-01-12T11:41:14Z 2022-01-14 1994-07-01 https://pubs.kist.re.kr/handle/201004/86024 Characteristics of Amorphous Tungsten Nitride Diffusion Barrier for Metal-Organic Chemical Vapor deposited Cu Metallization Conference 1 1994 Int'l Electron Devices and Materials Symp, pp.0 1994 Int'l Electron Devices and Materials Symp 0 0