Shim Jae Phil KIM HANSUNG Ju, Gunwu Hyeong rak Lim Kim Seong Kwang Jae-Hoon Han Sanghyeon Kim Kim Hyung-jun 2024-01-12T12:41:32Z 2024-01-12T12:41:32Z 2021-09-29 https://pubs.kist.re.kr/handle/201004/87184 English 2.5~7, 강원도 하이원리조트 Ge wafer bonding ultra thin body Ultra-Thin Body Ge(110)-OI on Si fabrication from Ge/AlAs/GaAs Substrate via wafer bonding technology Conference 2 한국반도체학술대회 한국반도체학술대회 KO