Shim Jae Phil Ju, Gunwu kim seong kwang KIM HANSUNG Sanghyeon Kim Kim Hyung-jun 2024-01-12T13:09:36Z 2024-01-12T13:09:36Z 2021-09-29 https://pubs.kist.re.kr/handle/201004/87650 English 11.21~24, 제주 GaAs MOSFET CMOS wafer bonding Thin body n- and p-GaAs FET on Si for CMOS integration Conference 1 The 4th International Conference on Advanced Electromaterials 2017 The 4th International Conference on Advanced Electromaterials 2017 KO