Kim Hyung-jun Sanghyeon Kim 2024-01-12T14:05:29Z 2024-01-12T14:05:29Z 2021-09-29 https://pubs.kist.re.kr/handle/201004/88801 English 11.6~9, 제주 wafer bonding III-V MOSFET M3D Wafer Bonging Process for III-V MOSFET and Monolithic 3D Integration on Si Substrates Conference 1 International Conference on Electronic Materials and Nanotechnology for Green Environment (ENGE 2016) International Conference on Electronic Materials and Nanotechnology for Green Environment (ENGE 2016) KO