Anshuman Bhuyan Jung Woo Choe Lee, Byung Chul Ira Wygant Amin Nikoozadeh Omer Oralkan Butrus T. Khuri-Yakub 2024-01-12T14:35:38Z 2024-01-12T14:35:38Z 2021-09-29 https://pubs.kist.re.kr/handle/201004/89452 English 3D volumetric ultrasound imaging with a 32×32 CMUT array integrated with front-end ICs using flip-chip bonding technology Conference 1 IEEE International Solid-State Circuits Conference Digest of Technical Papers 2013, pp.396 - 397 IEEE International Solid-State Circuits Conference Digest of Technical Papers 2013 396 397 US