Kim, Yong Tae Kim, Young-Hwan 2024-01-12T17:35:46Z 2024-01-12T17:35:46Z 2021-09-29 https://pubs.kist.re.kr/handle/201004/92861 English Cu diffusion barrier C doped WN ALD Cu interconnection Low stress C doped WN diffusion barrier for Cu interconnection Conference 1 International Conference on Solid State Devices and Materials 2013, pp.52 - 53 International Conference on Solid State Devices and Materials 2013 52 53 JA