Kim, Young-Hwan Yeong-Hyeon Hwang Won-Ju Cho Kim, Yong Tae 2024-01-12T20:06:48Z 2024-01-12T20:06:48Z 2021-09-29 https://pubs.kist.re.kr/handle/201004/95710 English WN diffusion barrier Cu nano via/contact Atomic layer deposition A new atomic layer deposition method and electrical performance of WN diffusion barrier for Cu nano via contact structures Conference 1 European Materials Research Society (E-MRS), 2012 European Materials Research Society (E-MRS), 2012 FR