Kim, Yong Tae Kim, Young-Hwan Kim, Seong Il 2024-01-12T21:06:26Z 2024-01-12T21:06:26Z 2021-09-29 https://pubs.kist.re.kr/handle/201004/96801 English Electromigration copper interconnect diffusion barrier ALD WN Electromigration test of a new Cu/WN/MSQ/Si interconnect structure Conference 1 Asia Pacific Interdisciplinary Research Conf.2011, pp.18pp-23 Asia Pacific Interdisciplinary Research Conf.2011 18pp-23 18pp-23 JA