Yeong Hyeon Hwang Won-Ju Cho Kim, Young-Hwan Kim, Yong Tae 2024-01-12T21:34:32Z 2024-01-12T21:34:32Z 2021-09-29 https://pubs.kist.re.kr/handle/201004/97237 English Cu via Contact resistance Thermal stability WN Diffusion barrier Thermal stability of Cu/WN/Si nano via contact structures Conference 1 Microprocesses and Nanotechnology Conference 2011, pp.p-11-58 Microprocesses and Nanotechnology Conference 2011 p-11-58 JA