Wafer bonding between InP and Ce:YIG(CeY2Fe5O12) using O2 plasma surface activation for an integrated optical waveguide isolator - Roh Jong Wook; YANG, JEONG SU; 옥성해; Woo, Deok Ha; Byun, Young Tae; Jhon, Young Min; T. Mizumoto; W. Y. Lee; Lee, Seok
Keywords: Wafer bonding; integrated optical waveguide isolator; O2 plasma surface activation; GGG; Ce:YIG; photonic integrated circuits