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Investigation of improved adhesion between Cu films and polyimide by PSII-EIAMAD technique

Authors

LEE, YEON HEE; Hong Ju Hi; 천혜진; HAN, SEUNG HEE

Citation

European Confernece on Applications of Surface and Interface Analysis, pp.91

Keywords

adhesion; copper; plasma; deposition; EIAMAD; polymer

URI

https://pubs.kist.re.kr/handle/201004/104869

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KIST Conference Paper > Others

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