Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Ki-Woong Chae | - |
| dc.contributor.author | JONG-KEUK, PARK | - |
| dc.contributor.author | Lee, Wook Seong | - |
| dc.date.accessioned | 2024-01-13T09:31:20Z | - |
| dc.date.available | 2024-01-13T09:31:20Z | - |
| dc.date.created | 2021-09-29 | - |
| dc.identifier.uri | https://pubs.kist.re.kr/handle/201004/105177 | - |
| dc.language | English | - |
| dc.subject | adhesion | - |
| dc.subject | refinement | - |
| dc.subject | insert | - |
| dc.subject | interface | - |
| dc.subject | densification | - |
| dc.title | Adhesion strength of diamond films with different grain size on WC-Co insert | - |
| dc.type | Conference | - |
| dc.description.journalClass | 1 | - |
| dc.identifier.bibliographicCitation | Carbon 2005 | - |
| dc.citation.title | Carbon 2005 | - |
| dc.citation.conferencePlace | KO | - |
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