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The Thermal Annealing Effect on the Residual Stress and Interface Adhesion in the Compressive Stressed DLC Film

Authors

Heon Woong Choi; 문명운; KIm Tae Young; Lee, Kwang Ryeol; Kyu Hwan Oh

Citation

Materials Research Society Symposium Proceedings, v.795, pp.U11.42.1(87) - U11.42.6(92)

Keywords

DLC; thermal anneling; residual stress

ISSN

0272-9172

URI

https://pubs.kist.re.kr/handle/201004/105804

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KIST Conference Paper > Others

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