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Electromigration-induced stress interaction between via and polygranular cluster

Authors

PARK YOUNG JOON; 최인석; 주영창

Citation

Mat. Res. Soc. Symp. Proc., v.612, pp.D8.11.1 - D8.11.6

Keywords

electromigration; stress; simulation

URI

https://pubs.kist.re.kr/handle/201004/108156

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KIST Conference Paper > Others

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