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Other Titles

Cavity를 갖는 SDB SOI 구조의 제작

Authors

Ju Byeong Kwon; 강경두; 정수태; Jung Jae Hoon; 정귀상

Citation

전기전자재료학회 하계학술대회, pp.557 - 560

Keywords

wafer bonding

URI

https://pubs.kist.re.kr/handle/201004/108307

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KIST Conference Paper > Others

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