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Enhancement of the electical and physical properties of Cu/W-N/HSQ interconnection scheme by NH₃ plasma treatment

Authors

김동준; 심현상; Kim Yong Tae; KIM CHUN KEUN; 박종완

Citation

The International Conference on Electrical Engineering 2000, pp.766 - 769

Keywords

W-N diffusion barrier

URI

https://pubs.kist.re.kr/handle/201004/108360

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KIST Conference Paper > Others

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