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Simulations of stress evolution and the current density scaling of electromigration-induced failure times in pure and alloyed interconnects

Authors

Vaibhav K. Andleigh; PARK YOUNG JOON; Carl V. Thompson

Citation

SRC TechCon '98 conference proceedings, Las Vegas, Nevada, Sep. 9-14, 1998, Symposium 8.4, pp.1 - 4

Keywords

electromigration; Simulation; stress evolution

URI

https://pubs.kist.re.kr/handle/201004/109924

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KIST Conference Paper > Others

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