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Vacuum sealing of field-emission arrays using field-assisted bonding method

Authors

이덕중; Ju Byeong Kwon; LEE YUN HI; OH MYUNG HWAN; LEE NAM YANG; 한정인; 조경익; 장진

Citation

Proc. SID '98, pp.589 - 592

Keywords

MEMS

ISSN

0098-0966

URI

https://pubs.kist.re.kr/handle/201004/110095

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KIST Conference Paper > Others

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