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Packaging of vacuum microelectronic device using electrostatic bonding

Other Titles

정전 열 접합에 의한 진공전자소자의 패키징

Authors

Ju Byeong Kwon; 이덕중; OH MYUNG HWAN

Citation

대한전기학회 추계학술대회, pp.?

Keywords

MEMS; FED; FEA

URI

https://pubs.kist.re.kr/handle/201004/110347

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KIST Conference Paper > Others

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