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Comparison of amorphous and polycrystalline tungsten nitride diffusion barrier for MOCVD-Cu metallization.

Authors

Kim Yong Tae; 권철순; 김동준; 이창우; 최인훈

Citation

Fall meeting of MRS, pp.?

URI

https://pubs.kist.re.kr/handle/201004/112200

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KIST Conference Paper > Others

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