Effect of Sn-addition on the bonding strength between casting Au-Pt-Cu alloy and SiO2-based porcelain
- Authors
- Lee, S. H.; Byeon, J. W.; Doh, J. M.; Lim, H. N.; Yoon, J. K.; Jung, H. Y.
- Issue Date
- 2007
- Publisher
- TRANS TECH PUBLICATIONS LTD
- Citation
- 8th International Symposium on Eco-Materials Processing and Design, v.544-545, pp.175 - +
- Abstract
- Effects of 0.5 wt% Sn-addition to the dental casting Au-12Pt-0.6Cu alloy oil the interfacial microstructures and bonding strength between porcelain and the alloy were investigated. Porcelain powders (SiO2-based oxides) are bonded through a thermal schedule consisting of pre-oxidation, 1(st) firing, and 2(nd) firing. Interfacial microstructures were examined after pre-oxidation and 2(nd) firing, respectively, by scanning and transmission electron microscopy. The bonding strength of the Au-12Pt-0.6Cu and Au-12Pt-0.6Cu-0.5Sn alloys with porcelain was about 24.6 MPa and 46.2 MPa, respectively. The higher bonding strength of the Sn-added alloy compared with that of the alloy without Sri is attributed to the SnO2 formed at the interface between porcelain and the alloy during pre-oxidation. SnO2 layer is thought to enhance chemical bonding with various oxides in the porcelain and, accordingly, improve bonding strength.
- ISSN
- 0255-5476
- URI
- https://pubs.kist.re.kr/handle/201004/116439
- DOI
- 10.4028/www.scientific.net/MSF.544-545.175
- Appears in Collections:
- KIST Conference Paper > 2007
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